Plasma Etchers - Ashers - Ion Mills
Used Plasma Etchers - Ashers - Ion Mills

Refurbished with a 30 Day Right of Return and 3-Month Warranty! (Unless sold "AS-IS" * )

Used  BRANSON/IPC  3000  Low Temperature Asher/Etcher. Quartz process chamber 10 in. dia. x 20 in. deep. PM-112 13.56 MHz RF Generator. With corrosive series vacuum pump.     Inventory#: 41378

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Used  BRANSON/IPC  P2100  Plasma Etcher/Stripper. Automatic and manual modes. Three process timers and three gas inputs. PM132 1000W 13.56 MHz RF generator. 150mm wafer compatible. Quartz Process Chamber: 12 in. dia. x 20 in. D. Includes vacuum pump.     Inventory#: 55590

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Used  BRANSON/IPC  S2100-11220  Low Temperature Plasma Asher. 11 in. dia. quartz process chamber. PM112 1000W, 13.56 MHz RF generator. Auto or manual modes. Includes vacuum pump.     Inventory#: 51932

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Used  BRANSON/IPC  S3100  Low Temperature Plasma Asher. System generates a low pressure, low temperature gaseous plasma. Plasma reactions such as ashing, etching and polymer surface modifications can be performed. 11 in. dia. x 19 in. quartz process chamber. PM112 13.56 MHz RF generator, 1000W. Includes vacuum pump.     Inventory#: 51912

Used  DIONEX  2000  Low Temperature Asher. Three process gas inputs. 10 in. dia. x 20 in. D quartz. PM 119 13.56 MHz 500W RF Generator. Corrosive series vacuum pump. Only one process control.     Inventory#: 39861

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Used  GATAN  600 CTMP  Turbo Pumped Argon/Reactive Plasma DuoMill Dual Station Ion Milling System. Ion milling system for the preparation of high quality TEM specimens. Two independent milling stations mounted on a single high speed vacuum system. Each milling station has a Whisperlok specimen exchange system which functions without disturbing the vacuum or milling conditions of the other station and two Octogun ion guns.     Inventory#: 53783

Used  HYPERVISION  CHIP UNZIP  Backside Preparation System. Low stress backside preparation system is useful for the development and analysis of flip-chips, lead-on-chips packaging and advanced chip design with more than 3 metallization layers. Software controlled milling to remove semiconductor packaging materials: epoxy molding compound, ceramic, metal and perform backside thinning on silicon die.     Inventory#: 48882

Used  MARCH INSTRUMENTS  CS-1701  THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR MARCH INSTRUMENTS SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Benchtop Reactive Ion Etching System (RIE). Tabletop plasma RIE system. Microprocessor control system provides user with flexibility and ease of use. Four MFC gas inputs. Capable of processing substrates up to 6 in. dia. RF generator 600W, 13.56 MHz. Includes vacuum pump.     Inventory#: 55116

Used  MARCH INSTRUMENTS  JUPITER II  THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR MARCH INSTRUMENTS SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Tabletop Reactive Ion Etcher. Parallel plate reactive ion etcher capable of handling up to a 6 in. wafer. 300 Watt 13.56 MHz RF Generator. Currently configured for one process gas and an N2 purge gas. Can be upgraded to handle 4 process gas inputs. With pump.     Inventory#: 38966

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Used  MARCH INSTRUMENTS  PX-1000  Plasma Etcher/Cleaner. Batch systems for plasma cleaning or etching. Currently configured with only one 17 in. x 14 in. shelf set. Can accommodate multiple shelves. RFX-600 13.56 MHz, 600W RF generator. Two gas inputs. Includes vacuum pump.     Inventory#: 58161

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Used  MARCH INSTRUMENTS  PX-250  Plasma Cleaning System. Multiple removable shelves can easily be configured to provide downstream or direct plasma. Shelves: 6 in. x 6 in. 300W, 13.56 MHz RF Generator. Includes vacuum pump. Two MFC gas inputs. Fast efficient method for surface treatment and cleaning prior to wire bonding, die attach, encapsulation, conformal coating and other processes. 208/230V, 1 Ph, 50/60 Hz, CE.     Inventory#: 57871

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Used  MARCH INSTRUMENTS  PX-500  Batch Plasma Treatment System. Gas plasma treatment provides a fast efficient method for surface treatment and cleaning. Automatic process control of vacuum and gas flow, chamber pressure, power level and endpoint. Configured for 2 process gas and N2. 13.56 MHz RF generator. Two electrodes 8 in. x 13 in. Includes vacuum pump.     Inventory#: 57071

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Used  MARCH INSTRUMENTS  PX-500  Batch Plasma Treatment System. Provides a fast efficient method for surface treatment and cleaning prior to wire bonding, die attach, encapsulation, conformal coating and other processes. Automatic process control of vacuum and gas flow, chamber pressure, power level and endpoint. Configured for two process gases and nitrogen. Advanced Energy RFX-600 13.56 MHz, 600W RF generator. Single 8 in. x 13 in. electrode shelf set. Includes vacuum pump.     Inventory#: 58174

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Used  METROLINE/IPC  7102  Automatic Plasma Treatment and Cleaning System. Menu driven programming with multi-step features. Parallel plates electrodes mounted vertically. Total of four sets with a surface area of 13 in. H x 28 in. D and a spacing of 1 in. between plates. Two gas inputs controlled via MFC. PE-2500 RF generator. Includes vacuum pump.     Inventory#: 56528

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Used  OXFORD  80 PLUS RIE  Compact Plasma Reactive Ion Etching System RIE. The vacuum chamber is configured for optimal gas conductance at the wafer thus maximizing etch rate and uniformity. All parameters controlled via front panel display. 9 in. dia. platen. Previously used with four MFC and gases used were CF4, O2, CHF3, AR. Does not have turbo pump option installed. Includes vacuum pump. 208V, 3 Ph, 60 Hz.     Inventory#: 57562

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Used  OXFORD  PLASMALAB 80 Plus  Turbopumped Reactive Ion Etch RIE System. PC controller with graphical user interface. Excellent across chamber uniformity. 500W, 13.56 MHz RF generator. Turbopumped chamber, includes roughing pump. Four gas inputs controlled via MFC. Previous gas used SF, O2, CHF3, N2. Shower head gas delivery method.     Inventory#: 55693

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Used  OXFORD  PLASMALAB 80 Plus PLC  Plasma System. More information to come contact us for details.      Inventory#: 56371

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Used  OXFORD INSTRUMENTS  PLASMALAB SYSTEM 100  Load Locked RIE Reactive Ion Etching System. System controlled and monitored by PC. Turbo pumped load lock. 8 in. dia. bottom electrode. Shower head style gas delivery. Advanced Energy RFX-600A 13.56 MHz 600W RF generator. Turbo pump on the load lock and one on the process chamber. Includes roughing pump.     Inventory#: 56082

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Used  PLASMA SCIENCES INC.  RIE-200W  Small Tabletop Reactive Ion Etcher RIE. Offers a complete anisotropic etch in a compact bench-top format. 7-1/2 in. chamber ID with 6 in. substrate surface. Roughing pump only, no turbo pump. Two gas inputs with needle valves. RF power 200W at 13.56 MHz.      Inventory#: 57484

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Used  PLASMA TECHNOLOGY  RIE 80  Reactive Ion Etch System. Simple manual system. Turbo pump and roughing pumps included. 300W 13.56 MHz RF Generator. Quartz chamber. 6 in. dia. electrode. Older system but sold fully tested and in good working condition.     Inventory#: 53890