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Used
ADVANCED DICING TECHNOLOGIES
982-6
Precision Dicing Saw.
Precision dicing, cutting and slotting for the semiconductor and microdevices industries.
Process parameters are totally programmable
through interactive menu-driven screens. 6 in. dia. vacuum chuck.
Air bearing spindle with 2 in. dia. blade and maximum speed of 40,000 rpm.
Video viewing of alignment and cutting.
Date of Mfg.: 9/2004.
Inventory#:
54731
Used
ADVANCED DICING TECHNOLOGIES
982-6
Precision Dicing Saw.
Automated process control.
Optimal combination of kerf quality, throughput and yield.
For wafers up to 6 in. dia. 2 in. dia. spindle with programmable speed from 4,000 rpm to 40,000 rpm.
Video viewing of alignment and cutting.
Date of Mfg.: 6/2004. 208V, 1 Ph, 50/60 Hz, 15A.
Inventory#:
54880
Used
ADVANCED DICING TECHNOLOGIES
982-6
Precision Dicing Saw.
Automated process control. Optimal combination of kerf quality, throughput and yield.
For wafers up to 6 in. dia. 2 in. dia. spindle with programmable speed from 4,000 rpm to 40,000 rpm.
Video viewing of alignment and cutting.
Date of Mfg.: 6/2004. 208V, 1 Ph, 50/60 Hz, 15A.
Inventory#:
54883
Used
ADVANCED IMAGING INC.
ROUGH LAP STATION
Polishing System.
Heavy duty polishing system.
18 in. dia. polishing wheel capable of holding 4 specimen rings.
Digital RPM readout. Motor timer. 115V, 60 Hz.
Inventory#:
55418
Used
BUEHLER
DUOMET II
Belt Surfacer for Two Step Coarse Grinding.
Built in flushing systems.
1/2 hp heavy duty motor.
Two belt system 4 in. x 9 in. grinding area.
115V, 60 Hz, 10.8A, CE.
Inventory#:
55411
Used
BUEHLER
FIBRMET
Portable Optical Fiber Polisher.
Quick and accurate means for polishing optical fiber ends to maximize light transmission.
No travel cover with unit. 115V, 60 Hz.
Inventory#:
52619
Used
BUEHLER
FIBRMET
Portable Optical Fiber Polisher.
Quick and accurate means for polishing optical fiber ends to maximize light transmission.
No travel cover with unit.
115V, 60 Hz
Inventory#:
52732
Used
BUEHLER
FIBRMET
Portable Optical Fiber Polisher.
Quick and accurate means for polishing optical fiber ends to maximize light transmission.
No travel cover with unit.
115V, 60 Hz.
Inventory#:
52318
Used
BUEHLER
FIBRPOL
Optical Fiber Polishing System.
Volume polishing of optical fiber and connectorized cable.
Semiautomatic system has the capability to simultaneously polish up to 40 optical fiber connectors.
115V, 60 Hz, 11A.
Inventory#:
55272
Used
BUEHLER
HANDIMET II
Roll Grinder for Fine Grinding of Metallographic Specimens.
Efficient four-stage fine grinding with controlled water flow for lubrication and flushing.
Four 3-7/16 in. x 11-1/2 in. grinding surfaces. No moving parts.
Inventory#:
55214
Used
BUEHLER
MICROMET II
Digital Micro Hardness Tester.
Digital readout provides instant diagonal measurements of the indentations and resultant hardness values.
120V, 60 Hz.
Inventory#:
52470
Used
BUEHLER
POLIMET I
Triple Wheel Polishing Table.
Table with three Polymet polisher/grinders.
Each polisher/grinder with independent controls. 8 in. bronze wheels with infinitely variable speeds.
100 to 1200 rpm and tachometer reading.
Two rinse sinks. Table length: 72-1/2 in.
115V, 60 Hz, 30A.
Inventory#:
54957
Used
BUEHLER
POLIMET I
Dual Wheel Polishing Table. Table with two Polymet polisher/grinders. Each polisher/grinder with independent controls. 8 in. bronze wheels with infinitely variable speeds. 100 to 1200 rpm and tachometer reading. Single rinse sink. Table length: 52-1/2 in. 115V, 60 Hz, 20A.
Inventory#:
55032
Used
DISCO
DAC-2SP/86
Automated Dicing Saw.
Max. Substrate Size: 150 mm.
Range of Indexing: 0.0001 to 99.9999 mm.
Minimum Step Indexing: 0.00025 mm.
Spindle Rotation: 3000 to 40,000 rpm.
Older dicing saw but in good condition.
Inventory#:
38633
Used
DISCO
DAD521
Automatic Dicing Saw.
Designed to cut brittle materials such as silicon wafers, glasses and ceramics.
Can accommodate wafers from 3 in. to 6 in.
Cutting Range: Circle: 0.01 to 160.00 mm. Square: 0.01 to 220.00 mm.
Vacuum Chuck: 6-1/4 in. dia.
4-Axis Index Setting Range: 0.0001 to 160.0000 mm, Min. Step: 0.2 micrometers.
Air bearing spindle programmable 3,000 to 40,000 rpm, water cooling.
200V, 3 Ph, 50/60 Hz.
Inventory#:
53305
Used
DYNATEX
DX-III
Scriber Breaker.
Fully programmable for all scribing and breaking parameters.
Wafers up to 39 mils thick can be processed, as well as die 5 mils sq.
Fully programmable for edge, skip and continuous wafer scribing.
Scribe angle is programmable in 0.1 degree increments.
Can be used for substrates up to 4 in. dia.
120V, 60 Hz, 5A.
Inventory#:
53522
Used
DYNATEX
GST-150
150mm Scriber Breaker. Capable of completely and automatically scribing and breaking many substrate materials. Alternative method to saw dicing for up to 6in. silicon and GaAs applications. Fully programmable for all scribing and breaking parameters.
Stored process eliminates operator adjustments when changing between wafer types.
Max. wafer size 150mm, wafer thickness 40 to 1725 micrometers. Minimum Die Size: 200 micrometers sq. 100/240V,1 Ph, 50/60 Hz, 10/5A,CE.
Inventory#:
53500
Used
DYNATEX
GST-150
150mm Fully Programmable Scriber Breaker.
Designed to increase yield and provide superior processing speeds.
Windows® operating environment provides a fast user friendly interface.
Zero kerf loss allows higher die density on wafer.
Fully programmable for all scribing and breaking parameters including TrueAngleTM diamond
tool positioning. Currently configured for 6 in. dia. tape rings and up to 4 in. dia. wafers.
Can be retooled to do up to 150mm wafers.
100-240V,1 Ph,50/60 Hz,10/5A, CE.
Inventory#:
55263
Used
K&S
7100 AD
Precision Dicing Saw.
Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield.
Up to 200 mm x 200 mm work area, 6 in. dia. porous vacuum chuck currently installed.
Z Axis Travel: 50 mm. Blade Capacity: 2 in. to 3 in.
Spindle speed programmable up to 60,000 rpm.
200/240V, 1 Ph, 50/60 Hz, 15A.
Inventory#:
54804