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Used
ADVANCED DICING TECHNOLOGIES
982-6
Precision Dicing Saw.
Precision dicing, cutting and slotting for the semiconductor and microdevices industries.
Process parameters are totally programmable
through interactive menu-driven screens. 6 in. dia. vacuum chuck.
Air bearing spindle with 2 in. dia. blade and maximum speed of 40,000 rpm.
Video viewing of alignment and cutting.
Date of Mfg.: 9/2004.
Inventory#:
54731
Used
ADVANCED DICING TECHNOLOGIES
982-6
Precision Dicing Saw.
Automated process control.
Optimal combination of kerf quality, throughput and yield.
For wafers up to 6 in. dia. 2 in. dia. spindle with programmable speed from 4,000 rpm to 40,000 rpm.
Video viewing of alignment and cutting.
Date of Mfg.: 6/2004. 208V, 1 Ph, 50/60 Hz, 15A.
Inventory#:
54880
Used
ADVANCED DICING TECHNOLOGIES
982-6
Precision Dicing Saw.
Automated process control. Optimal combination of kerf quality, throughput and yield.
For wafers up to 6 in. dia. 2 in. dia. spindle with programmable speed from 4,000 rpm to 40,000 rpm.
Video viewing of alignment and cutting.
Date of Mfg.: 6/2004. 208V, 1 Ph, 50/60 Hz, 15A.
Inventory#:
54883
Used
BUEHLER
ECOMET III
Polisher/Grinder.
8 in. polishing/grinding wheel.
1/3 h.p. dc motor.
Variable Speed: 50 to 500 rpm.
115V, 60 Hz, 5A.
Inventory#:
55040
Used
BUEHLER
FIBRMET
Portable Optical Fiber Polisher.
Quick and accurate means for polishing optical fiber ends to maximize light transmission.
No travel cover with unit. 115V, 60 Hz.
Inventory#:
52619
Used
BUEHLER
FIBRMET
Portable Optical Fiber Polisher.
Quick and accurate means for polishing optical fiber ends to maximize light transmission.
No travel cover with unit.
115V, 60 Hz
Inventory#:
52732
Used
BUEHLER
FIBRMET
Portable Optical Fiber Polisher.
Quick and accurate means for polishing optical fiber ends to maximize light transmission.
No travel cover with unit.
115V, 60 Hz.
Inventory#:
52318
Used
BUEHLER
MICROMET II
Digital Micro Hardness Tester.
Digital readout provides instant diagonal measurements of the indentations and resultant hardness values.
120V, 60 Hz.
Inventory#:
52470
Used
BUEHLER
POLIMET I
Dual Wheel Polishing Table.
Table with two Polymet polisher/grinders.
Each polisher/grinder with independent controls.
8 in. bronze wheels with infinitely variable speeds. 100 to 1200 rpm and tachometer reading.
Single rinse sink. Table length: 52-1/2 in.
115V, 60 Hz, 20A.
Inventory#:
54956
Used
BUEHLER
POLIMET I
Triple Wheel Polishing Table.
Table with three Polymet polisher/grinders.
Each polisher/grinder with independent controls. 8 in. bronze wheels with infinitely variable speeds.
100 to 1200 rpm and tachometer reading.
Two rinse sinks. Table length: 72-1/2 in.
115V, 60 Hz, 30A.
Inventory#:
54957
Used
BUEHLER
POLIMET I
Dual Wheel Polishing Table. Table with two Polymet polisher/grinders. Each polisher/grinder with independent controls. 8 in. bronze wheels with infinitely variable speeds. 100 to 1200 rpm and tachometer reading. Single rinse sink. Table length: 52-1/2 in. 115V, 60 Hz, 20A.
Inventory#:
55032
Used
DISCO
DAC-2SP/86
Automated Dicing Saw.
Max. Substrate Size: 150 mm.
Range of Indexing: 0.0001 to 99.9999 mm.
Minimum Step Indexing: 0.00025 mm.
Spindle Rotation: 3000 to 40,000 rpm.
Older dicing saw but in good condition.
Inventory#:
38633
Used
DISCO
DAD521
Automatic Dicing Saw.
Designed to cut brittle materials such as silicon wafers, glasses and ceramics.
Can accommodate wafers from 3 in. to 6 in.
Cutting Range: Circle: 0.01 to 160.00 mm. Square: 0.01 to 220.00 mm.
Vacuum Chuck: 6-1/4 in. dia.
4-Axis Index Setting Range: 0.0001 to 160.0000 mm, Min. Step: 0.2 micrometers.
Air bearing spindle programmable 3,000 to 40,000 rpm, water cooling.
200V, 3 Ph, 50/60 Hz.
Inventory#:
53305
Used
DYNATEX
DX-III
Scriber Breaker.
Fully programmable for all scribing and breaking parameters.
Wafers up to 39 mils thick can be processed, as well as die 5 mils sq.
Fully programmable for edge, skip and continuous wafer scribing.
Scribe angle is programmable in 0.1 degree increments.
Can be used for substrates up to 4 in. dia.
120V, 60 Hz, 5A.
Inventory#:
53522
Used
DYNATEX
GST-150
150mm Scriber Breaker. Capable of completely and automatically scribing and breaking many substrate materials. Alternative method to saw dicing for up to 6in. silicon and GaAs applications. Fully programmable for all scribing and breaking parameters.
Stored process eliminates operator adjustments when changing between wafer types.
Max. wafer size 150mm, wafer thickness 40 to 1725 micrometers. Minimum Die Size: 200 micrometers sq. 100/240V,1 Ph, 50/60 Hz, 10/5A,CE.
Inventory#:
53500
Used
K&S
7100 AD
Precision Dicing Saw.
Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield.
Up to 200 mm x 200 mm work area, 6 in. dia. porous vacuum chuck currently installed.
Z Axis Travel: 50 mm. Blade Capacity: 2 in. to 3 in.
Spindle speed programmable up to 60,000 rpm.
200/240V, 1 Ph, 50/60 Hz, 15A.
Inventory#:
54804
Used
K&S
7100 AD
Precision Dicing Saw.
Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield.
Up to 200 mm x 200 mm work area, 6 in. dia. porous vacuum chuck currently installed.
Z Axis Travel: 50 mm. Blade Capacity: 2 in. to 3 in.
Spindle speed programmable up to 60,000 rpm.
200/240V, 1 Ph, 50/60 Hz, 15A.
Inventory#:
54818
Used
K&S
7100 AD
Precision Dicing Saw.
Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield.
Up to 200 mm x 200 mm work area, 6 in. dia. porous vacuum chuck currently installed.
Z Axis Travel: 50 mm. Blade Capacity: 2 in. to 3 in.
Spindle speed programmable up to 60,000 rpm.
200/240V, 1 Ph, 50/60 Hz, 15A.
Inventory#:
54852
Used
K&S
7100 AD
Precision Dicing Saw.
Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield.
Up to 200 mm x 200 mm work area, 6 in. dia. porous vacuum chuck currently installed.
Z Axis Travel: 50 mm. Blade Capacity: 2 in. to 3 in.
Spindle speed programmable up to 60,000 rpm.
200/240V, 1 Ph, 50/60 Hz, 15A.
Inventory#:
54881
Multiple photos.. 
BUEHLER
ECOMET III
Polisher/Grinder.
8 in. polishing/grinding wheel.
1/3 h.p. dc motor.
Variable Speed: 50 to 500 rpm.
115V, 60 Hz, 5A.
Inventory#:
55040
Bid-Service
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732-863-9500