LOGITECH
-
1WBT2
Three Station Fully Automatic Wafer Bonder Used for bonding II-VI and III-V substrates to support disks for polishing or lapping. Can be used to mount parts of wafers or whole wafers up to 100 mm. Adjustable pressure and temperature with digital display of settings and actual parameters.
Price:
$17,500
Inventory Number:
46870
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* = Warranty terms
only apply to non "as-is" items. "As-Is" items will have different return and
warranty conditions. Contact us for details.
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