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Used
ADE MAGNETICS
DMS 4-VSM
Vibrating Sample Magnetometer with
Auto-Sample Rotation and Temperature Options.
Comprehensive control and analysis routines for production and research.
4 in. dia. pole electromagnet tapered to 2 in. for up to 18,000 Oe.
Signal processor chassis with card to control VSM vibrator, field control card, EMU signal lock-in amplifier and output filter, A/D converters for field and EMU.
Automatic sample rotation.
Liquid nitrogen/argon gas sample chamber designed for magneto-optic thin film compenstation temperature experiments and temperature studies of other magnetic materials.
Inventory#:
50765
Used
APPLIED MATERIALS
EXCITE
High Speed Particle Detection System for Bare Wafer or Patterned Wafer Inspection.
Inspects device wafers after processing is completed or inspects blanket films.
Blanket films can be inspected at over 60 wafers per hour and patterned wafers at over 45 wph.
.1µm particle detection on unpatterned silicon.
Windows NT operating system.
Currently configured for 200mm wafers but can be configured for 300mm.
Date of Mfg. 2003
Inventory#:
45994
Used
AST
VCA 3000S
Video Contact Angle System.
Incorporates computerized video imaging with contact angle analysis to evaluate wafer surface conditions.
120V, 60 Hz.
Inventory#:
52920
Used
AST PRODUCTS
VCA-2000
Video Contact Angle System with Computer
VCA-2500XE software on system with Windows 95, Surface Energy Ver. 1.14,
Autofast Ver. 2.32, Pendant Analysis Ver. 2.22.
Captures precise droplet profiles with high resolution camera.
As a function of computerized video image processing, analytical results are user-independent.
120V, 50/60 Hz.
Inventory#:
54010
Used
CDE
RESMAP 168
Creative Design Engineering Auto Cassette Load Four Point Probe Resistivity Mapping System. Types of data available are contour maps, 3D, line, data maps, histogram, diameter or radius scans, user defined and polar map. Auto cassette loading of wafers from 4 in. to 8 in. dia. Manual loading required for 2 in. and 3 in. wafers. Measurement Range: 2m ohm/sq to 5M ohm/sq. 115/230V, CE. Uses a four point probe to take measurements.
Inventory#:
54870
Used
DAINI SEIKOSHA
SFT/156
Fluorescent X-Ray Measurement System.
X-Y Stage: 3 in. x 3 in.
Travel Z.
Adjustment: 1.3 in. Min.
Measurement area: .005 in.
Inventory#:
34297
Used
DISCO
DFM-M150
Manual Wafer Tape Frame Mounter.
For mounting materials to be cut or ground.
Heated mounting surface to 60 deg C.
Wafer Diameter: 3 in. to 6 in.
115V, 60 Hz.
Inventory#:
55394
Used
FLEXUS
F2418
Thin Film Measurement System.
Accurately measures the stress of thin films at temperatures of up to 900 deg C.
Handles all substrates, including gallium arsenide.
Measurement performed using split-beam laser with no moving parts.
Older system with 386 PC but sold in good working condition.
Inventory#:
49059
Used
GAERTNER
L106C
Large Stage Ellipsometer.
Permits noncontact thickness and refractive index measurements
of thin transparent and semi-transparent films.
Manual hand positioning 15 in. dia. stage.
PC with Windows based software.
115V, 60 Hz.
Inventory#:
51204
Used
GSI LUMONICS
VOY 1212
High Performance Non-Contact Metrology System.
Fully automatic.
Windows® operating system.
Easy to program and use.
Powerful view metrology software.
Measuring Range: 300 x 300 x 150 mm.
115V, 50/60 Hz, 15A.
Inventory#:
47972
Used
GSI LUMONICS
WAFERMARK II
Laser I.D. Marking System.
Capable of marking wafers from 2 in. to 6 in. and can process up to 125 wafers per hour.
Marks at any location on the wafer.
Permits selection of marking speed, mark location, serialization and lot size.
PC controller. 208V, 3 Ph, 60 Hz.
Inventory#:
55446
Used
HYPERVISION
VISIONARY 2000-TM
Emission Microscope System.
For detecting defects unattained by other failure analysis techniques.
Defective regions emit light and are visible using highly intensified cameras.
Visionary 2000-TM enclosure mounted on a vibration isolation table.
Wentworth 6 in. manual probing station with motorized computer controlled microscope.
Inventory#:
48950
Used
JMAR
S2610-01
Non-Contact Automatic 3-Axis Tabletop Measurement System.
JMAR Video CMM® software.
Supports high magnification microscope optics.
Three channel computer controlled light source.
X-Y stage travel: 10 in. x 4 in.
115V, 60 Hz. Mfg. 2001.
Inventory#:
50626
Used
KARL SUSS
MA150
6 in. High Performance Cassette to Cassette Mask Aligner.
PC control with plasma touch screen operation.
Can handle up to 1000W lamps.
System is currently configured for 6 in. dia. wafers. Both proximity and contact modes.
Throughput of up to 80 wafers per hour. Splitfield microscope optics for fast alignment. Flat finder.
Inventory#:
54353
Used
KLA/TENCOR
P-11
Long Scan Surface Profiler.
Provides high precision surface topography measurements and analysis.
Quickly characterizes step heights, roughness, waviness, process induced stress,
radius of curvature and a range of geometrical features.
8 in. max. scan length. Scan Speed: 1 micro-meter/s.
Microhead SR low force measurement head.
115V, 60 Hz, 4A.
Inventory#:
53926
Used
KLA/TENCOR
SURFSCAN 6220
Unpatterned Surface Inspection System.
Specifications: Substrate/Sizes: 2 in., 3 in., 82*, 100, 125, 150, 200 mm. Thickness: SEMI standard wafer thickness. Material: Any opaque, polished surface which scatters less than 5 percent of incident light.
*Smaller sizes factory-set at time of order.
Defect Sensitivity: 0.09 micrometer diameter PSL sphere equivalent with greater than 80 percent capture rate.
Haze/Sensitivity: 0.02 ppm minimum. Resolution: 0.002 ppm.
Repeatability: Count repeatability error less than 0.5 percent at 1 standard deviation (Mean count greater than 500, 0.364 mm dia. latex spheres). Accuracy: Count Accuracy: Better than 99 percent (verified with VLSI Standards’ Relative Standard). Spatial Resolution: 50 mm spacing, minimum.
Dynamic Range: 0.07 micrometer to 9,999 mm in a single measurement.
Throughput: 100 wph (200 mm) at 0.12 mm.
Contamination: Less than 0.005 particles/cm2 greater than 0.15 mm dia. per single pass.
Cassette Handling: Single puck wafer handling from two cassettes (one sender/receiver, one receiver).
Illumination Source: 30 mW Argon-Ion laser, 488 nm wavelength
Operator Interface: Mouse and/or dedicated user keypad.
Physical Characteristics/Height: 168 cm (66 in.).
Shipping Weight: 300 kg (670 lbs).
Installation Requirements/Vacuum: 508 mm (20 in.) Hg.
Electrical: 200-240V, 50/60 Hz.
Power Requirement: 2 kVA. Ducted Venting: Two 102 mm (4 in.) exhaust hoses. Environment: Class 10 or better.
Inventory#:
51991
Used
KLA/TENCOR
SURFSCAN 6220
Unpatterned Surface Inspection System. Specifications: Substrate/Sizes: 2 in., 3 in., 82*, 100, 125, 150, 200 mm. Thickness: SEMI standard wafer thickness. Material: Any opaque, polished surface which scatters less than 5 percent of incident light. *Smaller sizes factory-set at time of order. Defect Sensitivity: 0.09 micrometer diameter PSL sphere equivalent with greater than 80 percent capture rate. Haze/Sensitivity: 0.02 ppm minimum. Resolution: 0.002 ppm. Repeatability: Count repeatability error less than 0.5 percent at 1 standard deviation (Mean count greater than 500, 0.364 mm dia. latex spheres). Accuracy: Count Accuracy: Better than 99 percent (verified with VLSI Standards’ Relative Standard). Spatial Resolution: 50 mm spacing, minimum. Dynamic Range: 0.07 micrometer to 9,999 mm in a single measurement. Throughput: 100 wph (200 mm) at 0.12 mm. Contamination: Less than 0.005 particles/cm2 greater than 0.15 mm dia. per single pass. Cassette Handling: Single puck wafer handling from two cassettes (one sender/receiver, one receiver). Illumination Source: 30 mW Argon-Ion laser, 488 nm wavelength Operator Interface: Mouse and/or dedicated user keypad. Physical Characteristics/Height: 168 cm (66 in.). Shipping Weight: 300 kg (670 lbs). Installation Requirements/Vacuum: 508 mm (20 in.) Hg. Electrical: 200-240V, 50/60 Hz. Power Requirement: 2 kVA Ducted Venting: Two 102 mm (4 in.) exhaust hoses. Environment: Class 10 or better.
Inventory#:
52467
Used
KLA/TENCOR
SURFSCAN 6220
Unpatterned Surface Inspection System. Specifications: Substrate/Sizes: 2 in., 3 in., 82*, 100, 125, 150, 200 mm. Thickness: SEMI standard wafer thickness. Material: Any opaque, polished surface which scatters less than 5 percent of incident light. *Smaller sizes factory-set at time of order. Defect Sensitivity: 0.09 micrometer diameter PSL sphere equivalent with greater than 80 percent capture rate. Haze/Sensitivity: 0.02 ppm minimum. Resolution: 0.002 ppm. Repeatability: Count repeatability error less than 0.5 percent at 1 standard deviation (Mean count greater than 500, 0.364 mm dia. latex spheres). Accuracy: Count Accuracy: Better than 99 percent (verified with VLSI Standards’ Relative Standard). Spatial Resolution: 50 mm spacing, minimum. Dynamic Range: 0.07 micrometer to 9,999 mm in a single measurement. Throughput: 100 wph (200 mm) at 0.12 mm. Contamination: Less than 0.005 particles/cm2 greater than 0.15 mm dia. per single pass. Cassette Handling: Single puck wafer handling from two cassettes (one sender/receiver, one receiver). Illumination Source: 30 mW Argon-Ion laser, 488 nm wavelength Operator Interface: Mouse and/or dedicated user keypad. Physical Characteristics/Height: 168 cm (66 in.). Shipping Weight: 300 kg (670 lbs). Installation Requirements/Vacuum: 508 mm (20 in.) Hg. Electrical: 200-240V, 50/60 Hz. Power Requirement: 2 kVA Ducted Venting: Two 102 mm (4 in.) exhaust hoses. Environment: Class 10 or better.
Inventory#:
54721
Used
KLA/TENCOR
SURFSCAN 6420
Unpatterned Surface Inspection System.
Easily detects sub-micron particles on rough surfaces such as polysilicon and tungsten, yet provides sensitivity better than 0.10 micrometers on polished silicon and epitaxial layers.
Particle data is provided in 2 and 3 dimensional displays.
Sample sizes from 100 mm to 200 mm.
208V, 1 Ph, 60 Hz, 16A.
Inventory#:
54179